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Ansys and Intel Foundry partner for EMIB 2.5D Assembly Tech.

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TLDR:

  • Ansys and Intel Foundry collaborate on multiphysics signoff solutions for EMIB 2.5D chip assembly technology
  • Ansys’ accurate simulation engines deliver higher speeds, lower power consumption, and greater reliability in advanced silicon systems

Ansys and Intel Foundry have partnered to provide multiphysics signoff solutions for Intel’s innovative 2.5D chip assembly technology using embedded multi-die interconnect bridge (EMIB) technology. This collaboration expands from single-die system-on-chip (SoC) to include Intel’s EMIB assembly technology, which allows for flexible die connections without the need for through-silicon vias (TSVs). Ansys’ RedHawk-SC Electrothermal platform enables thermal analysis with anisotropic thermal conduction, crucial for Intel’s backside power distribution technology. This collaboration aims to provide customers with higher performance products and a smooth user experience.

Intel’s Rahul Goyal, VP & GM, product and design ecosystem enablement, praises the collaboration and the advantages of EMIB technology over traditional stacking techniques. Ansys’ John Lee, VP and GM of electronics, semiconductor, and optics, highlights the platform’s ability to solve complex multiphysics challenges and meet stringent requirements for thermal, mechanical, performance, and reliability. The mutual goal is to make the full benefit of this innovation easily accessible to joint customers.

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